Texas Instruments (News - Alert) (TI) Incorporated has announced that Ditech Networks has selected Texas Instrument’s advanced carrier infrastructure platform for use in future platform products. 

TI’s TMS320TNETV3020 multicore digital signal processor (DSP)-based carrier infrastructure platform is flexible, scalable and incorporates high-density voice codec applications that enables Ditech to enhance the quality and performance of its voice quality solutions and to address next-generation carrier infrastructure requirements more cost effectively.

 

This relationship defines both TI and Ditech as key influencers in the communications industry’s migration to all-IP networks.

Ditech’s voice quality solutions are deployed on the company’s high-density, flexible platforms, which allow carriers to optimize voice quality over both IP and TDM networks. Ditech’s solutions for wireline and wireless service providers mitigate voice quality impairments that originate in the network, and in the caller’s environment. The company’s platforms also are used to deploy Ditech’s Dynamic Transcoding solution, which enables service providers to support diverse codecs in multiple IP networks. Ditech plans to use TI’s TNETV3020 carrier infrastructure platform at the heart of its future solutions.

TI’s TNETV3020 is powered by a six-core DSP and delivers 3 GHz of raw processing performance. Based on TI’s high-performance TMS320C64x+ DSP core, the network, quality and power management features integrated directly on the TNETV3020 system-on-a-chip (SoC) device will enable Ditech to significantly increase the capacity of its current solutions while allowing the company flexibility for additional applications.

Enabling these features directly from the core network gives Ditech the ability to support high-density voice quality applications, speeding time to market and saving development costs.

"The flexibility and performance features provided by TI’s carrier infrastructure solutions make us comfortable that this platform is a secure investment for our future products, ensuring carriers high-quality voice service and solution longevity" said Todd Simpson, President and CEO of Ditech Networks (News - Alert). "TI and Ditech are aligned in our initiative to provide high-density performance and carrier-grade quality of service. This shared commitment to delivering the highest level of voice quality is what sustains our longstanding relationship with TI"